...低温钎焊；搅拌；润湿性；金属间化合物[gap=1558]Key words: nano-Ni particle Sn-Cu-Ag composite solders; low-temperature soldering; stirring; wettability; intermetallic compound..
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Techniques for soldering and encapsulating aluminum-alloy case and substrate based on low-temperature aluminum soldering materials are described in the paper.
文章介绍了一种采用低温铝钎焊料和钎焊技术的铝合金外壳基板钎焊和密封方法。
The soldering glass has a rather low coefficient of expansion as well as low sealing temperature.
然而，通常热膨服系数高的封接玻璃软化温度低，而热膨胀系数低的软化温度偏高。
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