The results show that a certain extent, the other parameters constant, increasing power, increasing scanning speed, small grains become more dense;

结果表明：在一定范围内，其它工艺参数不变，增加功率，增大扫描速度，晶粒更趋致密细小；

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Under the conditions of other technological parameters unchanged, the microstructure of the coatings becomes smaller and more homogeneous with laser scanning speed increasing.

在其他工艺参数不变的条件下，随扫描速度的增大，熔覆层组织变得细小、均匀；

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Some pores appeared mainly near in the bond line, but porosity can be suppressed to a great extent by increasing welding speed or electron beam scanning.

结果表明，在保证试件完全焊透的情况下，降低电子束的线能量，可在一定程度上提高接头的强度；

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