长 金凸块 ( Gold Bumping )：在封装时须借由凸块与基板间做接合， 金凸块 也是IC讯号的连接点，是驱动IC 封装中，前段重要制程。
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The Citi Hilton HHonors Reserve Card from Citibank includes automatic Gold status, bumping you into preferred rooms and granting you Executive Lounge access at many Hilton properties.
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