die bonding 芯片焊接 ; 晶粒接着 ; 模片键合 ; 片焊接
Die bonding and wire bonding 封装工艺工程师
die bonding jig 管心焊接模
adhesive die bonding 粘胶贴片
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It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.
根据这些曲线，说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。
Application of inorganic bonding and acid corrosion in rubber die design and manufacturing was introduce.
介绍了氧化铜无机粘接和三酸腐蚀制造工艺技术在橡胶模具设计与制造过程中的应用。
Inorganic bonding was suitable for assembly and fixing of small punch of rubber, plastic and stamping die.
氧化铜无机粘接适合于橡胶、塑料以及冷冲压模具小型芯小冲头的装配与固定。
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