The model and the simulation results can be the reference in design of bonding process.
2
探讨了使用湿化学法对硅片表面进行活化,完成硅圆片低温直接键合的流程。
The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
3
晶片直接键合技术是材料集成的一项新工艺,是近年来集成光电子领域的研究热点之一。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.