[机] solderability

...料的廓张Solder bump(焊锡球)：球状的焊锡材料粘合在无源或者有源元件的接触区，起到与电路焊盘毗连的效用Solderability(可焊性)：为了形成很强的毗连，导体(引脚、焊盘或者迹线)熔湿的(变成可烧焊的)能力Soldermask(阻焊)：印刷电路板的处置惩罚技术，除开要...

[机] weldability

双金属排气阀的电子束焊接-加工工艺-机电之家网加工工艺栏目 关键词:排气阀;电子束焊接;可焊性 [gap=734]Key words: exhaust valve spindle;electric beam welding;weldability

 welding capacity

... welding cam (触及对于焊机的)增大压力凸轮 welding capacity可焊性 welding characteristics烧焊特征 ...

 Sloder Ability

... 焊盘拉脱强度Pull of Strength of Peels 可焊性Sloder Ability 翘曲度Bow and Twist ...