The paper discusses how to control the EMI in designing twolayer PCB at three points:part placement, routing and copper pour.

The resistance of the copper rate is low, so in printed circuit board, used to prepare copper foil and double panel, produce multilayer prototypes via metallization copper with on the process.

A new type of broadband printed twin dipole antenna is proposed in this paper. Corresponding feed structure of broadside coupled parallel line is also designed.