It provides comprehensive wafer fabrication services and technologies to semiconductor supplier and system companies.
它提供了全面的半导体晶圆制造服务、技术供应商和系统公司。
These vendor functions must be integrated for functions such as wafer fabrication, wafer test, module build, and module test.
这些供应商功能必须针对晶片制造、晶片测试、模块构建和模块测试等功能进行集成。
Using virtual wafer fabrication technique, different structures of high voltage LDMOS's are analyzed and compared, and optimized structures are obtained.
采用虚拟制造技术，分析比较了多种结构，对器件结构进行了优化。
ESD is an issue not only for finished products but also during their manufacture, from wafer fabrication to packaging to the assembly of complete systems.
ESD 的问题不仅对于成品来说很重要，在制造过程中（从晶圆制程、封装到组装整个系统）也是很重要的课题。
Wafer fabrication is one of the most complex and high competence manufacturing. How to fully utilize the machine capacity to meet customer demand is a very important topic.
晶圆制造为现今最复杂与高度竞争制造环境之一，因此，充分利用其现有产能来满足顾客需求，为一相当重要的课题。
SRB was verified on three different scale semiconductor wafer fabrication facilities simulation models by applying various dispatching rules on non-batch processing machines.
基于三种不同规模的半导体生产线模型，在非批加工设备使用不同的调度规则的情况下，对提出的SRB进行了仿真验证。
According to the characteristics of dynamic bottleneck in semiconductor wafer fabrication system (SWFS), a dynamic bottleneck real-time dispatching (DBRD) strategy was proposed.
针对半导体晶圆制造系统中瓶颈设备动态漂移的特性，提出一种动态瓶颈实时派工策略。
once the company is happy with the design of a wafer fabrication plant, it will “copy it exactly” in its other locations, says Professor Hargadon, “down to the paint on the wall.
一旦公司对某家晶圆生产工厂的设计表示满意，它就在另一个地点“照样复制”，哈格顿教授说，“一直具体到墙壁的涂料”。
A new agent-based dynamic scheduling approach for semiconductor wafer fabrication was proposed, which integrated release control, dispatching and machine preventive maintenance scheduling.
基于智能体技术，提出了芯片制造生产线动态调度新方法，实现了投料调度、工件调度与设备维护调度的集成。
Introduces wafer bonding process, technical requirements, application choice and Interaction for MEMS, and showing MEMS fabrication technology and application prospects.
介绍了晶圆键合工艺、技术要求、应用选择以及对MEMS的作用；展示了MEMS制造技术和应用前景。
Fabrication of solar silicon wafer consists of wafer slicing and texturing of its surface.
太阳能硅片的制造工艺主要包括硅片的切割以及绒面制备两部分。
The backside holes of prior art microphones typically require that a secondary machining operation be performed on the rear surface of the silicon wafer during fabrication.
现有技术中传声器的背侧孔典型地要求在制造过程中于硅片的后表面上进行一种二次机加工操作。
The model of the Boron ion spread in wafer was analyzed by numerical simulation and the micro resistor fabrication conditions were optimized.
通过数值计算，建立了制备过程中硅基底中的硼离子的空间浓度分布的理论模型，优化了二次硼扩散工艺条件。
A method for improving the critical dimension uniformity of a patterned feature on a wafer in semiconductor and mask fabrication is provided.
一种在半导体与罩幕制造中改善晶圆上的图案化特征结构的临界尺寸均匀性的方法。
The fabrication techniques with dissolved wafer process of sensitive element are expressed.
叙述了敏感元件的体硅溶解薄片法制造工艺。
Through the silicon bonding, we achieve a wafer-level vacuum package, and the wire-bonding PAD is made after the fabrication is complete.
在完成整体结构圆片级真空封装的同时，通过引线腔结构方便地实现了中间电极的引线。
Through the silicon bonding, the wafer-level vacuum package is achieved and the wire-bonding PAD is made after all the fabrication work is finished.
在完成整体结构圆片级真空封装的同时通过引线腔结构方便地实现了中间电极的引线。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
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