Fully automated "lights-out" fabs are in operation.
完全自动化的“熄灯”晶圆厂处于运作中。
To reach the economies of scale needed to make such investments pay, chipmakers must build bigger fabs.
为了达到规模经济以抵消大量的前期投入，芯片制造商必须建造更大的晶圆厂。
Toshiba will continue to keep and maintain its NAND flash fabs. There appears to be no change on that front.
不过闪存业务方面，东芝的战略则没有任何变化，他们仍将继续保留其名下的NAND闪存芯片厂。
All this explains why of the 40 fabs under construction in 2007, 35 were in Asia, three in America and only two in Europe.
所有这些解释了为什么2007年兴建的40个晶圆厂有35个在亚洲，3个在美国，只有两个在欧洲。
Within a few years fabs will be producing wafers with a diameter of 450mm, up from 300mm now, making them even more productive.
在几年之内，晶圆厂将生产出直径为四百五十毫米的晶圆，超出现在的300毫米，从而进一步提高产能。
Some firms, such as Texas Instruments, have chosen to go "fab-lite", meaning that they have their own fabs only for certain chips.
一些公司，例如德州仪器(TexasInstruments)，已经选择走“轻晶圆厂”道路，也就是说，他们有自己的只生产特定芯片的晶圆厂。
Rising fixed costs give rise to Moore's Second Law: as the cost of transistors comes down, the cost of fabs goes up, albeit not at quite the same rate.
固定成本上升引起摩尔第二定律：尽管不是完全相同的速率，随着晶体管成本下降，晶圆成本上升。
TSMC Chief technology Officer Jack Sun said last year at an IC-technology forum in Germany that a move to 450mm wafer fabs is important for cost reduction.
台积电首席技术官孙元成在去年于德国举办的一次芯片技术会议上曾表示450mm晶圆厂的设立对芯片厂减少成本具有重大意义。
DRAM prices and margins skyrocketed, and companies raced to build new fabs, some of which were ready for action just in time for the inevitable market downturn in 1997-98.
内存的价格和利润都在以火箭速度上升，各大公司争先恐后地建设新的内存芯片生产厂。
To simplify transportation and minimize the risk of contamination, fabs make use of "front-opening unified pods, " or FOUPs. Each one holds 25 wafers in a sterile, clean environment.
为了简化运输和尽可能降低被污染的风险，芯片制造商利用“前开式标准晶圆盒”即所谓的FOUP来搬运晶圆。每个无尘超净的晶圆盒中可放置25块硅晶圆。
To simplify transportation and minimize the risk of contamination, fabs make use of "front-opening unified pods, " or FOUPs. Each one holds 25 wafers in a sterile, clean environment.
为了简化运输和尽可能降低被污染的风险，芯片制造商利用“前开式标准晶圆盒”即所谓的FOUP来搬运晶圆。每个无尘超净的晶圆盒中可放置25块硅晶圆。
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