The bonding layer is adhered between the first chip and the second chip.
粘着层粘着于第一芯片与第二芯片之间。
Rural Buildings; Building energy saving; Sandwiched insulation roof panel; waterproof mortar; steel mesh; bonding layer; calcium silicate board.
村镇住宅；建筑节能；夹芯式保温屋面板；防水砂浆； 批荡网；粘结层；硅酸钙板；
The piezoelectric actuators are pasted to main structure by the bonding layer to transfer the strain and to achieve the control of the structure.
压电驱动器应用时要通过胶粘剂与主体结构固结，达到传递应变，实现控制结构变形的目的。
It is shown that the shear stress distribution in bonding layer has similar characteristics to the strain distributions near the ends of the actuator.
通过分析可得，粘贴层切应力的分布与致动器端部附近的应变分布有相似的特征。
The distributed force model of intelligent beam structures is presented considering the effect of bonding layer on the basis of theory of linear strain.
以线性应变理论为基础，提出了考虑粘贴层影响的智能结构梁分布力模型。
This paper shows that the shear stress distribution in bonding layer has similar characteristics as the strain distributions near the ends of the actuator.
通过分析可得，粘贴层剪切应力的分布与致动器端部附近的应变分布有相似的特征。
The porous nano-structure is used as a bonding layer, and thermocompression bonding can be realized at lower temperature and pressure due to the nano-scale effect.
利用该多孔纳米结构作为键合层，由于纳米尺度效应，可以在较低的温度和压力下实现热压键合。
The distributed force model of intelligent beam structures is presented in considering the effect of bonding layer on basis of hypothesis of linear strain in the paper.
基于线性应变假设，提出了考虑粘贴层影响的智能结构梁分布力模型。
The predicted deflection errors for the partially covered CPUA by the deflection model neglecting the bonding layer are obviously larger than those for the half covered CPUA.
忽略粘结层影响的情况下部分覆盖圆形压电单晶执行器挠度模拟误差明显大于半覆盖圆形压电单晶执行器挠度模拟误差；
In this paper, the tension bending coupling model is presented by virtual work principle, the effect of the bonding layer between beam and piezoelectric actuator is considered in the analysis.
利用虚功原理，建立了单面粘贴有压电致动器的梁结构的拉伸-弯曲耦合模型，在分析过程中，考虑了梁与致动器之间粘贴层的影响。
CLT is fabricated by bonding together timber boards with structural adhesives to produce a solid timber panel with each layer of the panel alternating between longitudinal and transverse lamellae.
交叉复合木材(CLT)是制备与结构胶粘剂粘接在一起板，木材生产与各片层之间的纵向和横向交流面板层的实木面板。
To consider the effect of bonding characteristics of the adhesives between the piezoelectric layer and the functionally graded ones, a linear spring layer model is adopted.
为了考虑中间压电层与上、下功能梯度层之间的粘结效果，采用线性弹簧模型以模拟界面性能。
Selection of adhesive for bonding strength fi eld pull-out tests of thermal insulation layer and substrate was introduced.
介绍了在保温板材与基层的粘结强度现场拉拔试验中粘结剂的选用。
The adhesive layer may include a bonding agent, such as a polymer gel, having a residual extraction force of between about 50 grams and about 200 grams.
该粘合层可包括例如聚合物凝胶的结合剂，该结合剂具有在大约50克和大约200克之间的残留物拨出力。
The captioned strength is forecasted in terms of different bonding points in a single concealed layer by means of BP calculating program.
应用BP算法程序对双金属材料的剥离强度按单隐蔽层不同结点数进行预报计算。
When bonding temperature was 1403 K, reaction layer grew fast at first and then slow down with the increase of bonding time.
在连接温度为1403K的条件下，随着连接时间的增加，界面反应层厚度先快速增加，再缓慢增加。
The interface layer of metallurgical bonding will not induce brittle fracture and will share the ductile SEM fractographs of the substrate.
这种界面冶金结合层并不会引起脆性断裂，具有与基材相同的韧性断口形貌。
The X-ray analysis reveals that the crystal structures of compounds 1 and 2 are two-dimensional layer structures through intramolecular hydrogen bonding and -? stacking.
射线分析显示化合物1和2的晶体结构均由分子间氢键和-弱相互作用堆积而成的二维层状结构。
The results show that there is an obvious bright intermediate belt between cladding alloy layer and the body, forming good metallurgic bonding.
结果显示，熔覆层与机体之间有明显的白亮过渡带，形成了良好的冶金结合。
The direct bonding joint between cemented carbide and nodular cast iron and the indirect bonding joint by using nickel foil as intermediate layer were obtained by HIP diffusion bonding process.
用热等静压扩散连接法获得了硬质合金与球墨铸铁的直接连接接头和以镍箔为中间夹层的间接连接接头。
The influences of surface treatments, the pressures during bonding process and the thickness of adhesive layer on shearing strength were investigated with epoxy resin-DDS curing system as adhesive.
采用环氧树脂-DDS固化体系作为胶接剂，探讨了各种金属表面处理方法、胶接时对胶接面施加的压力、胶层厚度等因素对胶接剪切强度的影响。
A new method for measuring bonding strength between electroplated layer and substrate of diamond tool is proposed.
提出一种新的电镀金刚石工具镀层与基体结合强度测试方法。
According to the theory of mechanical bonding, layer-to-layer bond strength was improved by making the surface become more roughness.
本文分析了光固化树脂层间结合机理，根据机械结合理论，增加表面粗糙度，增强层间结合强度。
Bonding force of substrate and adhesive layer is large. No adhesive failure occurs during storage and construction.
基材与胶层结合力大，在存放或施工过程中不存在脱胶现象。
The layer is smooth with higher microhardness, corrosion and bonding strength by using the proper process.
在合适的电刷镀工艺下，镀层表面平整、光滑，具有较高的显微硬度、耐蚀性和结合强度。
It has been reported that an intermediate layer can have significant impact on the chemical bonding between a HAP coating and a metallic substrate.
据文献报道，中间过渡层可以对HAP涂层和金属基体之间形成化学骨连结产生重要影响。
It has been reported that an intermediate layer can have significant impact on the chemical bonding between a HAP coating and a metallic substrate.
据文献报道，中间过渡层可以对HAP涂层和金属基体之间形成化学骨连结产生重要影响。
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