Joints between reinforcement members can be made satisfactorily with tin solder.
锡焊能够满意地做成加筋构件之间的接头。
We have determined tin and lead contents in tin solder using the XRF fundamental parameter method without standard sample in this paper.
本文在无标样的情况下，用X射线荧光基本参数法测定了焊锡中的锡和铅的含量。
The method is proved to be accurate, reliable, convenient and quick, absolutely suitable for the assaying of trace lead in silver tin solder.
方法准确、可靠、简便、快速，完全适用于银锡焊料中微量铅的检验。
The paper introduces the laser cut mould plate, the characteristics of tin solder and some problems which should be paid attention to in screen printing.
重点介绍了激光切割成型的模版、锡焊膏的特点及丝网印刷中应注意的问题。
The key factor is the proper amount of tin solder to be screen printed onto welded surface of PCB. To do this well, it's necessary to control several technological factors.
丝网印刷在双面印年刷电路板（ PCB）工艺中起着重要作用，最关键的环节是要掌握好网印到PCB焊盘上锡焊膏的量，要做到这一点，需要综合控制好多种工艺因素。
The process is directly between the two types of metal welding, a solid solder joint appearance, there is no brittle fracture caused by tin solder, oxidation, solder false.
该工艺是两种金属之间直接熔接，焊点美观牢固，没有锡焊引起的脆裂、氧化、虚焊、假焊。
All foot machine, automatic machine PC board feet cut, cut legs pushing machines manually solder equipment, hand Baptist tin stoves, printer, Tool Grinder.
切脚机，自动P C板切脚机，手推切脚机，手动焊锡设备，手浸锡炉，印刷机，磨刀机。
Max lay traps the traps of tin colonel sent CARDS and boarded a tanker killer, but being caught brought to the card before solder colonel.
马克斯设圈套诱杀了卡锡上校派来的杀手，登上了油轮，但却被抓住带到了卡锡上校面前。
The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.
主要产品有：焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。
A new stripper for removing the solder from the surface of waste printed circuit boards was developed on the basis of a nitric acid - sulfonic acid type tin stripper.
以硝酸-磺酸型退锡剂为基础配方，研制了一种脱除废旧电路板表面残留焊锡的剥离液。
The shear strength of BGA joint with eutectic solder is higher than that of tin-lead alloy itself.
共晶钎料BGA球焊点的抗剪强度比锡铅合金钎料自身的抗剪强度大。
Take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering.
以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。
Recycling waste tin material: lead-free solder recovery and recycling, tin tin slag the recycling, tin line recovery, solder paste recycling waste tin tin ash, such as waste lead recovery.
回收废锡料：无铅焊锡回收、锡渣回收、锡条回收、锡线回收、锡膏回收、锡灰等废锡废铅回收。
The invention relates to a copper particle reinforced type tin, silver and zinc composite solder and the preparation method.
本发明涉及一种铜颗粒增强型锡银锌复合焊料及其制备方法。
The invention relates to a silicon carbide particle reinforced type tin, silver and zinc composite solder and the preparation method.
本发明涉及一种碳化硅颗粒增强型锡银锌复合焊料及其制备方法。
At present, pure tin deposit has a bad solder reliability, tin-based binary alloy deposits have big brittleness or bad wettability, and noble metal deposits have high price.
目前，纯锡镀层的焊接可靠性差，锡基二元合金镀层有脆性大、润湿性差等方面的问题，贵金属镀层成本高。
A new type of solder was fabricated by adding microelements into tin-bismuth series solder and then being rapid cooled.
在锡铋系焊料中加入微量元素，通过快速冷却制成新的焊料，并对其组织与性能进行了研究。
In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.
文章通过试验证明：纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
Heat up your soldering iron and tin it by allowing it to melt a drop of solder onto its tip.
加热你的电烙铁，通过允许其热量融化的一滴锡滴在它的尖端来锡化它。
The apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper.
该装置(1)可使溶出于包含以锡作为主成分的无铅焊料中的铜作为金属间化合物析出以分离铜。
The effects of X content on the conductivity, thermal conductivity, tin melting rate, dryness, and other physical properties of the new lead-free solder were studied.
研究了X含量对新型无铅焊料的导电性、导热性、熔锡速度和干燥度等物理性能的影响。
To smear solder flux paste or colophony on the PCB board of the dismantlement of BGA, remove the tin of welding plate of PCB board with ferrochromium;
在拆除BGA的PCB板焊盘上涂上助焊膏或松香水，用电铬铁将PCB板焊盘上的锡去除；
Contact plating: Gold plating over Nickel on contact area tin plating on solder tail.
触点电镀：镀镍金的接触面积的锡焊尾电镀。
的锡焊尾，电镀。
Tin Plating on Solder Tail, Harpoon: Brass.
电镀锡焊尾，鱼叉：黄铜。
Welding can be easily shattered the tin-oxide layer, contact stability, which does not damage solder ball;
能轻松刺破焊接锡球的氧化，接触稳定，而又不会损坏锡球。
Welding can be easily shattered the tin-oxide layer, contact stability, which does not damage solder ball;
能轻松刺破焊接锡球的氧化，接触稳定，而又不会损坏锡球。
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