The experimental principles and equipment of thermal contact resistance were introduced.
介绍了接触热阻的测量原理和传统的实验装置。
According to the experiment results, the formula used to calculate the thermal contact resistance was adjusted.
根据实验结果，对接触热阻的计算公式进行了修正。
A new model of thermal contact resistance based on the statistic characteristic of roughness profile is proposed in this paper.
本文在对粗糙度曲线统计特征分析的基础上，提出了一种接触热阻的计算模型。
The thermal contact resistance between copper and stainless steel was investigated at 300 K and 20 K using the photothermal method.
选择航天器和低温工程中常用金属材料铜、不锈钢，用激光光热法原理，研究低温接触界面层热阻。
The thermal interface material provided by the invention has the characteristics of low thermal contact resistance and high heat-conducting efficiency.
本发明提供的热界面材料具有接触热阻小，导热率高的特点。
The mechanism of thermal contact resistance is discussed in detail, and influences of hysteresis and tangential stress on this resistance are studied experimentally and theoretically.
本文对产生接触热阻的机理进行了深入的讨论，对影响接触热阻的滞后效应和接触面上切应力等因素进行了实验研究和理论探讨。
The existence of the contact resistance must be considered when accurate thermal conductivity measurements are performed.
如果要精确地测量热导率，就必需考虑接触阻力的存在问题。
Because of the influences of such factors as machining tolerance etc., the contact thermal resistance between chip and cold plate can't be controlled effectively.
由于表贴器件制造公差的影响，器件与冷板间的接触热阻无法有效控制。
With this model, effects of the number and materials of the fin, the effective thermal conductivity of the bed and the contact heat resistance on the performance are studied.
考虑了工质对的吸附特性对脱附过程的影响，讨论了肋片数量、肋片物性参数、吸附床的有效导热系数、接触热阻等参数对脱附时间的影响。
Thermal resistance could decrease with the contact angle.
热管热阻值随接触角增大而减小。
Thermal resistance could decrease with the contact angle.
热管热阻值随接触角增大而减小。
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