• Suitable for and reflow soldering. .

    适合于一般焊接回焊。

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  • Available for reflow soldering and wave soldering.

    适应再流波峰焊。

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  • After reflow soldering rapid cooling should be avoided.

    避免回流焊接急速降温

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  • Reflow soldering should not be done more than two times.

    回流焊接最多只能进行

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  • Please follow "Reflow Soldering Conditions" in catalogue.

    遵守产品目录中的回流条件

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  • SMD lamp beads, manufactured through full automatic reflow soldering line.

    贴片自动化回流生产

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  • Design stencil according to requirement of inserter soldering quality and reflow soldering technology.

    根据插件焊接质量要求按照回流工艺设计印刷模板

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  • In the course of the lead free reflow soldering, lead and lead free of reflow soldering affect the quality of product.

    再流无铅化过程,再流有铅要素无铅要素兼容性直接影响产品质量

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  • Flux management systems and methods are provided for filtering vaporized flux from the gas of a reflow soldering oven.

    发明提供用来将汽化焊剂回流焊接气体过滤出来的方法焊剂管理系统

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  • Including optical analyzer, salt spray test machine, infrared reflow soldering, constant temperature oven, current load, etc.

    当中包括分析仪测试红外线回流恒温电流负载等设备

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  • New antenna structures and materials enable reflow soldering, multilayer component substrates and thus multifunctional systems as well.

    新型天线结构材料使回流多层成分载体因此多功能系统

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  • Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.

    回流应用加热金属表面熔融连接凝固两个金属涂层。

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  • Then, through reflow soldering, the installation element is fixed on the rigid board, and the protrusion board is detached from the installation element.

    然后通过回流焊接将安装元件固定刚性上,接着突出板安装元件上卸下

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  • Design the stencil as common as possible when designing insert reflow soldering stencil, in order to brief technological process and meet better print effect.

    设计插件回流印刷模板,应尽可能设计普通模板简化工艺流程满足较好的印刷效果

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  • Furthermore, the soldering process of PCBA in the whole infrared reflow soldering stove is modeled by the finite element software, ANSYS, and is simulated by the three-dimensional modelling.

    此外利用有限元ansys软件PC B组件整个红外再流中的焊接过程建立实体模型,进行了PC B组件再流焊全过程的三维动态模拟仿真

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  • The purpose of NMP baking is to decrease amount of water from plastic packages prior soldering. As absorbed water vaporise in reflow, internal cracks and failures may be created.

    NMP目的为了减少烘烤水量塑料包装事先由于蒸发吸收回流可能会产生内部裂纹失败

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  • Lead-free wave soldering, wave soldering, wave soldering machines, reflow.

    无铅波峰,波峰焊,波峰焊接回流焊

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  • Which lead-free wave soldering , lead-free reflow after several years of research and development, has now reached international advanced level.

    其中无铅波峰焊、无铅回流焊经过几年研究开发目前已达到国际先进水平。

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  • A new site specific method has been designed to run performance qualifications on boards built with specific soldering materials, reflow Settings and cleaning methods.

    我们已经设计出一种全新的定点方法,针对采用特定焊料回流设定清洗方法的电路板进行性能合格测试。

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  • Suitable for reflow when cheat protection, electronic circuit boards wave soldering tin stove and shelter.

    适用回流对金手指的保护电子线路板波峰焊锡遮蔽。

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  • Suitable for reflow when cheat protection, electronic circuit boards wave soldering tin stove and shelter.

    适用回流对金手指的保护电子线路板波峰焊锡遮蔽。

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