Generally the same fluxes will work for lead-free solder.
一般来说，相同的焊剂用于无铅焊料是有效的。
Through research, choose one or two lead-free solder paste.
通过研究，选择一种或两种无铅锡膏。
At last, the progress trend of lead-free solder is pointed out.
最后指出了无铅焊料的发展趋势。
So study lead-free solder paste in the electronic application package is important.
因此研究无铅锡膏在电子封装中的应用具有重要意义。
Lead-free solder bar is one kind of environmental-friendly product with good stability.
无铅锡条是一种环保型，稳定性很好的产品。
Lead-free solder wire is one kind of environmental-friendly product with good stability.
无铅锡线是一种环保型，稳定性很好的产品。
Nitrogen Protection is used in practical industry because of poor wettability of lead-free solder.
由于无铅钎料润湿性较差，在实际生产中普遍采用氮气保护。
So it is very necessary to study the wettability of lead-free solders and electromigration of solder joints.
因此开展低成本无铅焊料润湿性和焊点电迁移研究非常有必要。
This paper describes the development trend of low melting point and high melting point type Lead-free solder paste.
概述了低熔点和高熔点型无铅焊膏的开发动向。
This paper's actual production of lead-free solder paste and lead-free soldering process has been systematically studied.
本文结合公司的生产实际，对无铅锡膏和无铅焊接工艺进行了系统研究。
Therefore, electroplating of lead-free solder coating is one of investigation hotspots in electronic electroplating field.
因此，电沉积无铅可焊性镀层是电子电镀领域的研究热点之一。
The cross-section test and dye&pry test are adopted to study the failure mechanism of CSP lead-free solder interconnection.
采用剖样实验和染色实验对无铅焊料微互连的失效机理进行分析。
This article take Japan as an example, introduce technical topic and development direction of low temperature lead-free solder.
文章以日本为例，介绍低温无铅焊料的技术课题与开发方向。
Each sculptural planter is made-to-order with handmade glass and lead-free solder and comes with everything you need but the plants.
每个艺术花盆都是定制的。它们由手工制作的玻璃和无铅焊料接合而成，交付使用时，万事俱备，只欠花卉。
X-RAY-ray inspection using a lead-free solder paste of voids issue, found that the size and diameter welded hollow in acceptable range.
使用X-RAY射线检测了无铅锡膏的焊接空洞问题，发现焊接空洞的大小和直径都在可以接受范围内。
The factors affecting soldering ability of rosin-based flux for lead-free solder paste, and the factors affecting erosion resistance are discussed.
实验结果表明，松香种类不影响无铅焊膏用松香型助焊剂的助焊性能。
The main products are: solder wire, lead-free solder bar, line, lead-free solder paste, strips, tin ingots, flux, electroplating anode, babbitt, etc.
主要产品有：焊锡丝、焊锡条、无铅锡线、无铅锡条、锡膏、锡锭、助焊剂、电镀阳极棒、巴氏合金等。
Thermal fatigue life of lead-free solder joint of Air-conditioner PCB (Printed Circuit Board) under the form of THT (Through Hole Technology) is studied.
本文对空调器印刷电路板(PCB)通孔插装形式无铅焊点的热疲劳寿命进行了研究。
Circulated nitrogen system is designed to improve the wettability and fluidness of lead-free solder and to ensure that the solder joints are shiny and bright.
氮气循环使用，增加无铅焊料的侵润性和流动性，使锡点饱满光亮。
In order to predict failure location of BGA lead-free solder joints under a drop impact, ABAQUS software is used to analysis stress distribution of the solder joints.
为了预测跌落碰撞下球栅阵列(BGA)封装中无铅焊点的失效，采用ABAQUS软件来模拟跌落碰撞过程中焊点的应力分布。
The effects of X content on the conductivity, thermal conductivity, tin melting rate, dryness, and other physical properties of the new lead-free solder were studied.
研究了X含量对新型无铅焊料的导电性、导热性、熔锡速度和干燥度等物理性能的影响。
Due to the consideration of environmental protection, the substitution of lead-containing solder with lead-free solder has become an inevitable trend in the 21st century.
进入21世纪，由于环境保护的要求，锡铅焊料将逐步被无铅焊料所取代。
The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (SMT).
随着微电子表面组装技术的迅猛发展，软钎料尤其是无铅钎料逐渐成为研究的焦点。
Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.
笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述；
The apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper.
该装置(1)可使溶出于包含以锡作为主成分的无铅焊料中的铜作为金属间化合物析出以分离铜。
Having optimized preheat temperatures, solder pot temperatures, and flux volume, the conveyor speed may have to be reduced to accommodate the solder wetting when using lead-free solder.
对预热温度、焊料槽温度和焊剂体积进行优化后，还可将传送带速度降低，以适应使用无铅焊料时的熔湿速度。
Recycling waste tin material: lead-free solder recovery and recycling, tin tin slag the recycling, tin line recovery, solder paste recycling waste tin tin ash, such as waste lead recovery.
回收废锡料：无铅焊锡回收、锡渣回收、锡条回收、锡线回收、锡膏回收、锡灰等废锡废铅回收。
Experimental results show that lead-free solder paste in the poor mobility of steel line, resulting in deposition area, volume and height of the maximum and minimum fluctuation is obvious;
实验表明，无铅锡膏在钢网上的流动性很差，导致沉积面积，体积和高度的最大值和最小值的波动变化十分明显；
The sequential thermal cycling (TC) and drop impact test is more reasonable to evaluate the reliability of lead-free solder interconnections compared with single TC test or drop impact test.
焊料微互连在热周期和跌落冲击顺序载荷下的可靠性研究更具有实际意义。
Through appearance testing, X-Ray testing and temperature cycling testing, the reliability of mixed solder joints and lead-free solder joints which formed under various process parameters was assesed.
通过对不同工艺参数下形成的混合焊点和无铅焊点进行了外观检测、X射线检测和温度循环测试。
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