The hot-embossing theory was introduced, and the hot-embossing machine of microfluitic chip was designed.
介绍了热压成型的原理，并对微流控芯片热压成型机进行了总体设计。
For the needs of a new type of biodegradable implantable drug delivery, temperature control device and temperature control system of the hot-embossing equipment were designed and manufactured.
针对一种新型可降解植入式药物载体的高效制备需要，进行聚合物多腔体微结构热压成形设备的温度控制装置和温度控制系统研制。
The hot embossing and bonding machines have been used practically in microfluidic chip automatic fabrication, and the chips have satisfactory quality, precision, repetition and consistency.
塑料微流控芯片热压键合设备已经投入自动化生产，生产的芯片质量、精度、重复性和一致性良好。
Aiming at the lost accuracy happened in HEL (hot embossing lithography) because of thermal distortion, room-temperature imprint lithography is proposed.
针对热压印光刻工艺中因热变形而导致精度丧失的问题，提出了冷压印光刻。
In addition, we have the product also includes hot and cold setting machine, embossing machine, coating machine.
另外我们的产品还包括有冷热定型机、模压机、涂胶机等。
At present, a long period is needed to adjust parameters of microchannel figuration under hot embossing for the fabrication of PMMA microfluidic chip.
目前，PMMA微流控芯片微通道成形过程中热压参数的调整周期很长。
A thermoelectric cooler was used as the main component of temperature controlling in hot embossing device to acquire high precision temperature control.
采用热电致冷器作为温度控制的主控元件构建了热压成型系统。
There are a few varieties in nanoimprint, which can be loosely divided into hot embossing, UV-cured imprinting, and micro-contact printing.
纳米压印光刻技术主要包括热压印、紫外固化压印和微接触法压印。
Reported in this processes of piano-embossing and rolling-embossing, and the hot-stamping technique for transfering the embossed holograms to other materials is presented as also.
本文介绍了平压、滚压工艺过程及所用的原材料及设备，同时还介绍了将模压全息图应用到别的载体材料上的热冲压转印技术。
Then, with the obtained PC microcavity structure serving as a mold, a hot embossing process is applied to finally achieve a polymethylmethacrylate (PMMA) MLA.
然后以PC微凹透镜阵列为二次模板，再通过热压印制得了聚甲基丙烯酸甲酯（PMMA）的微凸透镜阵列。
In chapter 3, the process technology of silicon mold by means of photolithography and wet etching was introduced, which is a important process of hot embossing technology.
第三章介绍的是热压工艺中的一个重要工艺环节——硅阳模制作工艺。
A thermoelectric cooler was used as the main component of temperature controlling in hot embossing DE...
采用热电致冷器作为温度控制的主控元件构建了热压成型系统。
It can adjust the hot stamping delay time and pressure, to get different results on the products, especially for embossing and creasing effect.
可调校烫印停留时间及烫印压力，以达到各种烫印，模切效果，烫印浮雕及重压力压痕效果特佳。
It can adjust the hot stamping delay time and pressure, to get different results on the products, especially for embossing and creasing effect.
可调校烫印停留时间及烫印压力，以达到各种烫印模切效果，烫印浮雕及重压力压痕效果特佳。
Using plastic in fabrication microfludic chips and realizing automating is the key to extend the applications. Temperature is one of the important parameters in hot embossing.
采用聚合物如塑料等制作微流控芯片是拓展芯片应用，实现芯片产业化的关键。
Using plastic in fabrication microfludic chips and realizing automating is the key to extend the applications. Temperature is one of the important parameters in hot embossing.
采用聚合物如塑料等制作微流控芯片是拓展芯片应用，实现芯片产业化的关键。
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