Thermal stress model 热应力场模型
The stress of anodic bonding is analysed and the math model of no match thermal stress about anodic bonded elastic diaphragm is built.
通过对静电封接结构的受力分析，建立了静电封接后弹性膜片的热失配应力数学模型。
The thermodynamic model was established for analyzing the temperature and the thermal stress in laser medium.
为模拟激光介质的温度、热应力的分布和变化，建立了激光介质热力学计算模型。
A finite element mathematical model was developed to calculate the thermal elastoplastic stress of continuous casting billet in mold.
建立了结晶器内连铸坯热弹塑性应力有限元数学模型。
应用推荐