The stress of anodic bonding is analysed and the math model of no match thermal stress about anodic bonded elastic diaphragm is built.
通过对静电封接结构的受力分析，建立了静电封接后弹性膜片的热失配应力数学模型。
The thermodynamic model was established for analyzing the temperature and the thermal stress in laser medium.
为模拟激光介质的温度、热应力的分布和变化，建立了激光介质热力学计算模型。
A finite element mathematical model was developed to calculate the thermal elastoplastic stress of continuous casting billet in mold.
建立了结晶器内连铸坯热弹塑性应力有限元数学模型。
All these lead to the model of the thermal elastic stress, thermal elastoplastic stress and residual stress based on some simplications.
在此基础上，建立了能反映整个激光加工过程的主要物理特征的热弹性应力、热弹塑性应力以及残余应力的简化模型。
Considering gravity, interfacial shear stress, surface tension and interfacial thermal resistance, the analysis model for annular flow condensation heat transfer in microtube was presented.
本文提出了微圆管内环状流凝结换热的分析模型，考虑了重力、汽液界面剪切力、表面张力以及界面凝结热阻的作用。
The model was numerically solved by FEM, fully coupled for thermal-chemical model and one way coupled for the stress model.
其中热-化学模型可采用完全耦合的形式求解，而应力模型则可采用单向耦合的形式求解。
Thus in this paper a two-dimension thermal elastoplastic and creep stress (TEPC) model for thin slab strand is developed.
针对这一目的，文中建立了薄板坯连铸二维热弹塑性蠕变应力(TE PC)模型。
Thus in this paper a two-dimension thermal elastoplastic and creep stress (TEPC) model for thin slab strand is developed.
针对这一目的，文中建立了薄板坯连铸二维热弹塑性蠕变应力(TE PC)模型。
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