精密加工设备&&& 切割机(Dicing Saw), 切断机(Cutting Saw) Specification Comparison Chart 激光切割机(Laser Saw) 研削机(Grinder) 抛光机(Polisher), 干式蚀刻机(...
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从上胶膜(Tap er)、芯片研磨(Grinder)、装配(Mounter)以至于芯片切割(Dicing Saw)等步骤，都需进行机台的调整以配合300mm晶圆的加大尺寸。
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wafer dicing saw 切片锯 ; 转让划片机
substrate dicing saw 衬底切割锯
dicing saw network management 切割锯刀网路管理 ; 切割
IC Dicing saw 主要市场
ZSH5 dicing saw ZSH5型划片机
Precision Dicing Saw 精密切割机
grinding or dicing saw 移机相关资料
以上来源于: WordNet
The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed.
从全自动划片机的工作机理出发，分析空气静压电主轴、晶圆传输定位、自动对准、自动清洗等全自动划片机的关键技术；
The design method and way for control program of HP-801Automatic Dicing Saw is introduced in the paper. It approaches a path to design control program in semiconductor manufacturing equipment.
主要阐述了HP - 801精密自动划片机控制程序的设计及实现手段熏为高精密电子专用设备的控制程序设计开发拓展一些思路与方法。
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