• For fabrication, a thin film process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.

    制作上,根据性能结构要求采用高密度布线、多芯片组装薄膜工艺

    dict.cnki.net

  • For fabrication, a thin film process of high density routing and multi-chip assembly is adopted to meet the performance and structure requirements.

    制作上,根据性能结构要求采用高密度布线、多芯片组装薄膜工艺

    dict.cnki.net

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