In the last two years, Electroglas has made major new technology introductions for 200mm and 300mm wafer probing and final test handling.

在过去的两年中，伊智主要为200 mm和300 mm晶圆探针台和封装测试处理引入了新的技术。

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Measures have been discussed for preventing the Al film for being pierced through by the probe in wafer probing on the 1034 Wafer prober.

本文打算在1034探针台上针对如何避免探针扎穿铝层问题作一讨论。

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Of the three, Electroglas continues to be the only company focused on wafer probing technology and remains the technology leader in this segment.

值得一提的是，伊智公司是三者之中，惟一一家始终致力于晶圆探针技术研究的公司，并保持在该领域处于技术领先地位。

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