It is found that the chip has the main following defects: surface ripple, flashing, overall crinkling, sink mark in mirco-structure and incomplete duplication.
通过试验发现,微流控芯片产生的缺陷种类主要有:表面波纹、飞边、整体缩痕、微结构缩痕、微沟道复制度不高等。
参考来源 - 微结构塑件注射成型模拟与试验研究·2,447,543篇论文数据，部分数据来源于NoteExpress
Too high switch point: empty part, weld line, sink mark, and small.
转压点太高：产品充模不足，熔接痕，凹陷，尺寸偏小等。
How much pressure? Thicker section is it possible to occur sink mark?
压力有多大？厚的区域是否有可能出现缩水的现象？
No sink mark, flow lines or other visual imperfections to be on visible surfaces.
没有缩痕、流痕或其他视觉可见的表面缺陷。
应用推荐