... bonding adhesive 芯片键合用粘合剂 ; 胶粘剂 ; 粘合剂 ; 粘接剂 bonding pair 成键电子对 ; 成键电子对于 ; 键对 ; 计算键对 bonding bar 等电位连接带 ; 等电位联结带 ...
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... bonding adhesive 芯片键合用粘合剂 ; 胶粘剂 ; 粘合剂 ; 粘接剂 bonding pair 成键电子对 ; 成键电子对于 ; 键对 ; 计算键对 bonding bar 等电位连接带 ; 等电位联结带 ...
基于1个网页-相关网页
Based on the analysis, the heat sink materials, cooling liquid, the heatsink structure, and the bonding of laser bar are optimized in order to increase the transfer efficiency.
通过分析，对微通道热沉材料、冷却液、微通道热沉的结构参数以及热沉与激光器列阵条的封装等进行了优化设计。
The bonding mechanism between deformed bar and lightweight concrete is discussed in this paper based on the pullout test results of 75 specimens.
本论文是通过对75个试件的拉拔试验来探讨陶粒混凝土与变形钢筋之间的粘结锚固性能。
The bonding mechanism between deformed bar and lightweight concrete is discussed in this paper based on the pullout test results of 69 specimens.
通过对69个试件的拉拔试验来探讨陶粒混凝土与变形钢筋之间的粘结锚固性能。
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