文章摘要信息 关键词 ： 化学机械抛光；抛光液膜；流场；数值模拟 [gap=1021]Keywords : chemical mechanical polishing;slurry film;flow field;numerical simulation
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It is shown that the thickness and pressure distribution of slurry film vary with the wafer gradient,polishing load and speed,and show the same tendency with the experimental results.
结果表明,不同抛光速度和抛光载荷下,抛光液膜厚度、液膜压力和晶片倾斜角呈现不同的分布规律。
参考来源 - CMP抛光液流场数值仿真·2,447,543篇论文数据，部分数据来源于NoteExpress
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