Technics of LTCC MLB processing using thin film circuit technology, ink-jet printing, laser drilling, and conventional manufacturing methods is introduced.
概述了综合运用薄膜线路技术、喷墨打印技术和激光钻孔技术以及采用常规技术制作LTCC基板的简要工艺。
Technics of LTCC MLB processing using thin film circuit technology, ink-jet printing, laser drilling, and conventional manufacturing methods is introduced.
概述了综合运用薄膜线路技术、喷墨打印技术和激光钻孔技术以及采用常规技术制作LTCC基板的简要工艺。
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