The encapsulate composite for pulsed piezoelectric power supplier was investigated in this paper, in which a bisphenol A liquid epoxy EP828/E51 was resin matrix and aluminum oxide was filler.
本论文研究的复合封装材料以双酚A型环氧树脂EP828／E51作为基体，以氧化铝作为填充材料，有望替代纯环氧固化物作为脉冲压电电源用新型封装材料。
The encapsulate composite for pulsed piezoelectric power supplier was investigated in this paper, in which a bisphenol A liquid epoxy EP828/E51 was resin matrix and aluminum oxide was filler.
本论文研究的复合封装材料以双酚A型环氧树脂EP828／E51作为基体，以氧化铝作为填充材料，有望替代纯环氧固化物作为脉冲压电电源用新型封装材料。
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